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■ 半導體製程膠帶

半導體製程膠帶 Elep Holder
ELEP HOLDER is a wafer protection and holding type with a number of outstanding properties as well as high reliability.Manufactured under strictly controlled clean environment,the type comes in a wide range of base materials,thicknesses,and adhesion levels.You can choose the right type for the specific requirements of your back grinding,dicing, and bonding processes.

For back grinding process


Type Product No. Base
material
Thickness
μm
Width
mm
Length
m
Color Adhesion
N/20mm
(gt/20mm)
Features Applicable
machine
models
Wafer surface protection tape
BT-50E-F
PET
95
120~230
(or3",4",
5",6",8")
100
(or pes)
Light blue
0.20(20)
Excellent etching resistivity
NEL-DR Type
NEL-GR Type
NEL-DSA Type
BT-50E-FK
0.29(30)
BT-150E-AL
EVA
150
120
|
150
|
180
|
230
100
Light blue
0.69(70)
-
BT-150E-BLK
0.78(80)
Against water penetration
BT-150E-CM
0.20(20)
Excellent TTV/Less contamination
BT-150E-DL
0.39(40)
BT-150E-EL
0.74(75)
BT-200E-CM
200
0.20(20)
Thicker adhesive layer for ink dot/bump wafer
BT-230E-CM
230
0.20(20)
Peeling protectio tape
BT-315
PET
85
38-50-75
100
Light yellow
20(2,000)
For peeling BT-50,150 Series
NEL-HR Type
NEL-HSA Type
BT-315S
Silver
For peeling BT-50,150 Series(anti-static type)
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update: 2017-10-19